Copper, as a common metal material, is not only widely used for its conductivity but also highly favored for its unique color and texture. However, when exposed to the environment for an extended period, copper surfaces tend to form a layer of oxidation, affecting its appearance and performance. Therefore, the polishing process for copper components is particularly crucial. This article explores the key techniques in the polishing process of copper components, focusing on effective methods for cleaning and removing copper oxide, and showcasing the significant differences in the products before and after polishing.
Cleansing and removing copper oxide are critical steps in the polishing process. Traditional methods include mechanical removal, chemical cleaning, and electrochemical methods. Mechanical removal methods mainly use grinding and polishing to remove the oxide layer, but they have the disadvantages of complex processes and low efficiency. Chemical cleaning methods use solutions such as acids and alkalis to corrode the oxide layer, but they are hazardous and harmful to the environment. Electrochemical methods remove the oxide layer through electrolysis, with the advantages of simple operation and noticeable effects, but they require professional equipment and technical support.
In recent years, various new cleaning technologies have emerged to address these issues, such as laser cleaning, sandblasting, and ultrasonic cleaning. Laser cleaning uses high-energy laser beams to instantly irradiate the copper surface, evaporating and removing the oxide layer, with the advantages of high efficiency and no pollution. Sandblasting cleaning uses high-speed jetted abrasive particles to impact the copper surface, removing the oxide layer, suitable for large areas and complex-shaped workpieces. Ultrasonic cleaning utilizes ultrasonic vibrations to generate a bursting effect of microbubbles in
Post time: Nov-01-2023